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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages by Gerard Kelly (1999, Hardcover) 
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages by Gerard Kelly (1999, Hardcover)

 
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages by Gerard Kelly (1999, Hardcover)

Author: Gerard Kelly
Publisher: Kluwer Academic Pub
Publication Date: 1999-06-01
Language: English
Format: Hardcover
ISBN-10: 0792384857
ISBN-13: 9780792384854
Product ID: EPID1802667
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