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Process Engineering Analysis in Semiconductor Device Fabrication by Arthur Hochberg, Stanley Middleman (1993, Hardcover) 
Process Engineering Analysis in Semiconductor Device Fabrication by Arthur Hochberg, Stanley Middleman (1993, Hardcover)
Publisher: McGraw-Hill College
Publication Date: 1993-01-01
Series: MCGRAW HILL CHEMICAL ENGINEERING SERIES
Language: English
Format: Hardcover
ISBN-10: 0070418535
ISBN-13: 9780070418530
Product ID: EPID29273
Portions of this page Copyright 1995 - 2009 Muze Inc. All rights reserved.
Details
Publication Date:1993-01-01
Series:MCGRAW HILL CHEMICAL ENGINEERING SERIES

Size
Height:9.8 in
Width:7.0 in
Thickness:1.5 in
Weight:44.0 oz

Publisher's Note
Anyone involved in the field of chemical engineering or responsible for process design, maintenance, and analysis will appreciate Process Engineering Analysis in Semiconductor Device Fabrication - the only current book that offers comprehensive coverage of the growing interest in process improvement. Now, more than ever, it is evident that process improvement will enhance attempts to improve economic efficiency in the semiconductor device industries. Much of the book includes recent material presented with a degree of integration and criticism not available in the original journal publications. Worked examples illustrate how one uses fundamental principles to model processes. Where possible, models are compared with experimental data, and the success and/or failure of a model is presented as a learning experience. In addition, an extensive set of problems offers an opportunity for the reader to be guided into directions beyond the scope of the book itself. The two authors' vast combined experience in the fields of chemical engineering, process engineering, electrical engineering, and physics offers readers expert insight into as well as broad exposure to new areas of technology.

This new text is written primarily for chemical engineering students. Worked examples illustrate how one uses fundamental principles to model processes. Where possible, models are compared to experimental data and the success and/or failure of a model is presented as a learning experience. Much of the text involves new material presented with a degree of integration and criticism not available in the original (journal) publications.

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