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Microvias by John H. Lau, S. W. Ricky Lee (2001, Hardcover, Illustrated) 
Microvias by John H. Lau, S. W. Ricky Lee (2001, Hardcover, Illustrated)

 
Microvias by John H. Lau, S. W. Ricky Lee (2001, Hardcover, Illustrated)

Publisher: McGraw-Hill
Publication Date: 2001-04-01
Language: English
Format: Hardcover
ISBN-10: 0071363270
ISBN-13: 9780071363273
Product ID: EPID1754923
Portions of this page Copyright 1995 - 2009 Muze Inc. All rights reserved.
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Details
Publication Date:2001-04-01
Edition Description:Illustrated

Size
Length:565 pages
Height:9.0 in
Width:6.0 in
Thickness:1.8 in
Weight:38.4 oz

Publisher's Note
State-of-the-art introduction to high-density interconnect technology

The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee’s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.

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