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The Mechanics of Solder Alloy Interconnects by D.R. Frear, Harold S. Morgan, S.N. Burchett (1994, Hardcover) 
The Mechanics of Solder Alloy Interconnects by D.R. Frear, Harold S. Morgan, S.N. Burchett (1994, Hardcover)
Publisher: Kluwer Academic Pub
Publication Date: 1994-05-01
Language: English
Format: Hardcover
ISBN-10: 0442015054
ISBN-13: 9780442015053
Product ID: EPID997790
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Details
Publication Date:1994-05-01
Editor:John H. Lau

Size
Height:9.3 in
Width:6.3 in
Thickness:1.2 in
Weight:27.2 oz

Industry Reviews
As the trend toward the increased miniaturization of devices continues, solder interconnects are becoming the limiting factor in the reliability of electronic packages. The authors discuss the basic metallurgy of solder alloys, the constitutive models available for modeling solder interconnects, computational simulations to predict solder joint geometry, and the application of mechanics models to through-hole and surface mount technologies. Each chapter is written as a "stand-alone" resource for a particular aspect of materials and modeling issues. Annotation copyright Book News, Inc. Portland, Or.
Shalit

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