8853L6U IBM BladeCenter HS21 8853 ...
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IBM eServer™ BladeCenter® HS21 (8853L6U) 
IBM eServer™ BladeCenter® HS21 (8853L6U)

 
IBM eServer™ BladeCenter® HS21 (8853L6U)

Manufacturer Part: 8853L6U
Brand: IBM
Model: eServer™ BladeCenter® HS21
Form Factor: Blade
Processor: Xeon Dual Core 3 GHz
Product ID: EPID66963849
Description: Designed to support high-performance Dual-Core or Quad-Core Intel Xeon Processors and packed with high-performance and high availability features, the HS21 blade delivers density without sacrificing processor performance or availability.
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8853L6U IBM BladeCenter HS21 8853 - Blade - 2-way - 1
Location: Colorado
 
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Product Information
Designed to support high-performance Dual-Core or Quad-Core Intel Xeon Processors and packed with high-performance and high availability features, the HS21 blade delivers density without sacrificing processor performance or availability.

Product MPN
MPN8853L6U

Key Features
Form FactorBlade
ProcessorXeon Dual Core 3 GHz
Processors Qty.1
Controller TypeSAS (Serial Attached SCSI) x 1
Installed Memory1 GB (DDR2 SDRAM (Chipkill))
PlatformPC, Sun

Processor
Processor ManufacturerIntel
Processor TypeXeon Dual Core
Processor Speed3 GHz
Socket TypeSocket 604
Installed Qty1
Max Supported Qty2
Processor UpgradabilityUpgradable

Memory
Installed RAM1 GB
RAM TechnologyDDR2 SDRAM (Chipkill)
Maximum RAM16 GB
Number of Memory Slots4 x 240 Pin DIMMs
Supported RAM speeds667 MHz

Networking
Networking Type10/100/1000 Network Adapters x 2
Data Link ProtocolEthernet, Fast Ethernet, Gigabit Ethernet

Technical Features
Integrated Input/Output PortsRJ45 Lan Port x 2

Motherboard
Installed L2 Cache Memory4 MB
ChipsetIntel 5000P
Video Output InterfacePCI

Audio / Video
Max. Video Resolution1024 x 768
Installed Video Memory16 MB

Other Features
Expansion Bays2 x 2.5"
Bios TypeFlash ROM
Regulatory ApprovalCSA-C22.2 No. 60950 3rd. Ed., FCC Class A, FCC Part 15, ICES, ISO 9241-3, NOM, UL 60950 3rd. Ed.
Power ConfigurationsWake On LAN Header
Other Features64bit Ready, Dual Channel Memory Architecture, Hyper Thread Technology Ready, Virtualization Technology

Dimensions
Width1.1 in.
Depth17.6 in.
Height9.6 in.
Weight12 lb.

Miscellaneous
UPC000435947574
Release DateAugust, 2006

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