Series: Electronic Packaging & Interconnection Series
Language: English
Format: Hardcover
ISBN-10: 0070595771
ISBN-13: 9780070595774
Product ID: EPID29624
Description: This book focuses on the design of surface mount PC boards, and features the latest breakthroughs in fine pitch and ball-grind-array devices. Readers will find step-by-step guidance for developing the most cost-effective products possibl...
Synopsis This book focuses on the design of surface mount PC boards, and features the latest breakthroughs in fine pitch and ball-grind-array devices. Readers will find step-by-step guidance for developing the most cost-effective products possible using SMT.
Details
Publication Date:
1995-12-01
Series:
Electronic Packaging & Interconnection Series
Edition Description:
Subsequent
Size
Length:
261 pages
Height:
10.0 in
Width:
7.5 in
Thickness:
0.8 in
Weight:
22.4 oz
Publisher's Note This fully updated and revised edition of the classic surface mount technology guide features new material covering fine pitch technology and ball grid array packaging, and many other new SMT components and techniques developed in the four years since the writing of the first edition. This is the most concise and practical SMT book on the market, and the author is well-known throughout the industry.