| Details | | Publication Date: | 1991-10-22 | | Edition Description: | Subsequent |
| Size | | Height: | 9.8 in | | Width: | 6.5 in | | Thickness: | 1.2 in | | Weight: | 32.0 oz |
Publisher's Note Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.
Industry Reviews Experience has shown that reducing the junction temperature of electronic components has not increased their reliability as much as desired because of stress resulting from differences in thermal coefficients of expansion. The many possible failure mechanisms -- and preventive measures -- that determine the reliability of electronic components are addressed here, with new chapters on the use of finite element methods to design and analyze electronic equipment, and environmental stress screening. Annotation copyright Book News, Inc. Portland, Or. SciTech Book News
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